Authors

Salahouelhadj, Abdellah; Gonzalez, Mario; Vanstreels, Kris; Podpod, Arnita; Phommahaxay, Alain; Rebibis, Kenneth June; Beyne, Eric

Conference

20th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

Title

Study of wafer warpage for Fan-Out wafer level packaging: finite element modelling and experimental validation

Publication type

Proceedings paper

Embargo date

9999-12-31