Publication:

Study of wafer warpage for Fan-Out wafer level packaging: finite element modelling and experimental validation

Date

2019
Proceedings Paper
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dc.contributor.authorSalahouelhadj, Abdellah
dc.contributor.authorGonzalez, Mario
dc.contributor.authorVanstreels, Kris
dc.contributor.authorPodpod, Arnita
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorSalahouelhadj, Abdellah
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorPodpod, Arnita
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSalahouelhadj, Abdellah::0000-0002-3795-1446
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-27T17:28:03Z
dc.date.available2021-10-27T17:28:03Z
dc.date.embargo9999-12-31
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33927
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8724578
dc.source.beginpage1
dc.source.conference20th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
dc.source.conferencedate24/03/2019
dc.source.conferencelocationHannover Germany
dc.source.endpage7
dc.title

Study of wafer warpage for Fan-Out wafer level packaging: finite element modelling and experimental validation

dc.typeProceedings paper
dspace.entity.typePublication
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