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Investigating moisture diffusion in Mold Compounds (MCs) for Fan-Out-Wafer-Level-Packaging (FOWLP)
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Authors
Salahouelhadj, Abdellah
;
Gonzalez, Mario
;
Podpod, Arnita
;
Beyne, Eric
DOI
10.1109/ECTC51906.2022.00268
EISBN
978-1-6654-7943-1
ISSN
0569-5503
Conference
72nd IEEE Electronic Components and Technology Conference (ECTC)
Journal
na
Title
Investigating moisture diffusion in Mold Compounds (MCs) for Fan-Out-Wafer-Level-Packaging (FOWLP)
Publication type
Proceedings paper
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2
20.500.12860/40442.2
*
2023-02-20T13:57:29Z
validation by library/open access desk
1
20.500.12860/40442
2022-09-17T02:52:08Z
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