Browsing by author "Podpod, Arnita"
Now showing items 1-20 of 21
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A novel fan-out concept for ultra-high chip-to-chip interconnect density with 20-μm pitch
Podpod, Arnita; Slabbekoorn, John; Phommahaxay, Alain; Duval, Fabrice; Salahouelhadj, Abdellah; Gonzalez, Mario; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2018) -
A unique temporary bond solution based on a thermoplastic material tacky at room temperature and highly thermally resistant application extension from 3D-SIC to FO-WLP
Phommahaxay, Alain; Nakamura, Atsushi; Potoms, Goedele; Bertheau, Julien; Bex, Pieter; Duval, Fabrice; Podpod, Arnita; Verbinnen, Greet; Kamochi, Yoshitaka; Sawano, Mitsuru; Beyer, Gerald; Sleeckx, Erik; Beyne, Eric (2017) -
Advanced dicing technologies for combination of wafer to wafer and collective die to wafer fusion bonding
Inoue, Fumihiro; Phommahaxay, Alain; Podpod, Arnita; Suhard, Samuel; Hoshino, Hitoshi; Berthold, Moeller; Sleeckx, Erik; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric (2019) -
Advances in temporary carrier technology for high density fan-out device build-up
Podpod, Arnita; Phommahaxay, Alain; Bex, Pieter; Slabbekoorn, John; Bertheau, Julien; Salahouelhadj, Abdellah; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric; Guerrero, Alice; Yess, Kim; Arnold, Kim (2019) -
Challenges and solutions on pre-assembly processes for thinned 3D wafers with micro-bumps on the backside
Podpod, Arnita; Demeurisse, Caroline; Rebibis, Kenneth June; Gerets, Carine; Phommahaxay, Alain; Capuz, Giovanni; Duval, Fabrice; Sleeckx, Erik; Struyf, Herbert; Miller, Andy; Beyne, Eric; Beyer, Gerald (2014) -
Development of compression molding process for Fan-Out wafer level packaging
Bertheau, Julien; Duval, Fabrice; Kubota, Tadashi; Bex, Pieter; Kennes, Koen; Phommahaxay, Alain; Podpod, Arnita; Beyne, Eric; Miller, Andy; Beyer, Gerald (2020) -
Enabling pre-sssembly process of 3D wafers with high topography at the backside
Podpod, Arnita; Demeurisse, Caroline; Inoue, Fumihiro; Duval, Fabrice; Visker, Jakob; De Vos, Joeri; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2015) -
High density and high bandwidth chip-to-chip connections with 20μm pitch flip-chip on fan-out wafer level package
Podpod, Arnita; Velenis, Dimitrios; Phommahaxay, Alain; Bex, Pieter; Fodor, Ferenc; Marinissen, Erik Jan; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2018) -
Investigating moisture diffusion in Mold Compounds (MCs) for Fan-Out-Wafer-Level-Packaging (FOWLP)
Salahouelhadj, Abdellah; Gonzalez, Mario; Podpod, Arnita; Beyne, Eric (2022) -
Investigation of advanced dicing technologies for ultra low-k and 3D integration
Podpod, Arnita; Inoue, Fumihiro; De Wolf, Ingrid; Gonzalez, Mario; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric (2016) -
Morphological characterization and mechanical behavior by dicing and thinning on direct bonded Si wafer
Inoue, Fumihiro; Podpod, Arnita; Peng, Lan; Phommahaxay, Alain; Rebibis, Kenneth June; Uedono, Akira; Beyne, Eric (2020) -
Novel temporary bonding and debonding solutions enabling an ultrahigh interconnect density FO-WLP structure assembly with quasi-zero die shift
Podpod, Arnita; Phommahaxay, Alain; Bex, Pieter; Kennes, Koen; Bertheau, Julien; Arumugam, Hariharan; Cochet, Tom; Rebibis, Kenneth June; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric (2019) -
On the feasibility of die-to-wafer inorganic dielectric bonding
Wang, Teng; Podpod, Arnita; Capuz, Giovanni; Peng, Lan; Phommahaxay, Alain; Inoue, Fumihiro; Bex, Pieter; Dubey, Vikas; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2016) -
Picking large thinned dies with high topography on both sides
Gerets, Carine; Derakhshandeh, Jaber; Wang, Teng; Capuz, Giovanni; Podpod, Arnita; Demeurisse, Caroline; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2014) -
Probing complexities of 3D-stacked ICs – A test engineers' perspective
Fodor, Ferenc; De Wachter, Bart; Podpod, Arnita; Stucchi, Michele; Marinissen, Erik Jan (2020-11) -
Solutions to multiple probing challenges for test access to multi-die stacked integrated circuits
Marinissen, Erik Jan; Fodor, Ferenc; Podpod, Arnita; Stucchi, Michele; Jian, Yu-Rong; Wu, Cheng-Wen (2018-11) -
Study of the influence of material properties and geometric parameters on warpage for Fan-Out Wafer Level Packaging
Salahouelhadj, Abdellah; Gonzalez, Mario; Podpod, Arnita; Rebibis, Kenneth June; Beyne, Eric (2018) -
Study of wafer warpage for Fan-Out wafer level packaging: finite element modelling and experimental validation
Salahouelhadj, Abdellah; Gonzalez, Mario; Vanstreels, Kris; Podpod, Arnita; Phommahaxay, Alain; Rebibis, Kenneth June; Beyne, Eric (2019) -
Study on Process Induced out-of-plane deformation for Fan-Out Wafer Level Packaging
Salahouelhadj, Abdellah; Gonzalez, Mario; Podpod, Arnita; Beyne, Eric (2020) -
The growing applilcation field of laser debonding: from advanced packaging to future nanoelectronics
Phommahaxay, Alain; Guerrero, Alice; Kennes, Koen; Podpod, Arnita; Brems, Steven; Slabbekoorn, John; Tussing, Sebastian; Spiess, Walter; Penger, Luke; Yess, Kim; Arnold, Kim; Rapps, Thomas; Lutter, Stefan; Sleeckx, Erik; Huyghebaert, Cedric; Asselberghs, Inge; Miller, Andy; Beyer, Gerald; Radu, Iuliana; Beyne, Eric (2019)