Toggle navigation
My submissions
Login
Toggle navigation
View item
imec Publications Repository
imec Publications
Conference contributions
View item
imec Publications Repository
imec Publications
Conference contributions
View item
JavaScript is disabled for your browser. Some features of this site may not work without it.
High density and high bandwidth chip-to-chip connections with 20μm pitch flip-chip on fan-out wafer level package
View/
open
38859.pdf (508.4Kb)
Metadata
Show full item record
Authors
Podpod, Arnita
;
Velenis, Dimitrios
;
Phommahaxay, Alain
;
Bex, Pieter
;
Fodor, Ferenc
;
Marinissen, Erik Jan
;
Rebibis, Kenneth June
;
Miller, Andy
;
Beyer, Gerald
;
Beyne, Eric
Conference
16th Annual International Wafel Level Packaging Conference - iWLPC
Title
High density and high bandwidth chip-to-chip connections with 20μm pitch flip-chip on fan-out wafer level package
Publication type
Proceedings paper
Embargo date
9999-12-31
Collections
Conference contributions
Search imec Publications Repository
This collection
Browse
All of imec Publications Repository
Collections
Publication date
Authors
Titles
Subjects
imec author
Availability
Publication type
This collection
Publication date
Authors
Titles
Subjects
imec author
Availability
Publication type
My account
login