Publication:

High density and high bandwidth chip-to-chip connections with 20μm pitch flip-chip on fan-out wafer level package

Date

2018
Proceedings Paper
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dc.contributor.authorPodpod, Arnita
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorBex, Pieter
dc.contributor.authorFodor, Ferenc
dc.contributor.authorMarinissen, Erik Jan
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorPodpod, Arnita
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorFodor, Ferenc
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecPhommahaxay, Alain::0000-0001-8672-2386
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.date.accessioned2021-10-26T01:24:58Z
dc.date.available2021-10-26T01:24:58Z
dc.date.embargo9999-12-31
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31549
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8573262
dc.source.beginpage1
dc.source.conference16th Annual International Wafel Level Packaging Conference - iWLPC
dc.source.conferencedate23/10/2018
dc.source.conferencelocationSan Jose, CA USA
dc.source.endpage5
dc.title

High density and high bandwidth chip-to-chip connections with 20μm pitch flip-chip on fan-out wafer level package

dc.typeProceedings paper
dspace.entity.typePublication
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