Publication:

On the feasibility of die-to-wafer inorganic dielectric bonding

Date

2016
Proceedings Paper
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Author(s)

Wang, Teng
;
Podpod, Arnita  
;
Capuz, Giovanni  
;
Peng, Lan  
;
Phommahaxay, Alain  
;
Inoue, Fumihiro  
;
Bex, Pieter  
;
Dubey, Vikas
;
Rebibis, Kenneth June  
;
Miller, Andy  
;
Beyer, Gerald  
;
Beyne, Eric  

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1941 since deposited on 2021-10-23
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Acq. date: 2026-04-15

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