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On the feasibility of die-to-wafer inorganic dielectric bonding

Date

2016
Proceedings Paper
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dc.contributor.authorWang, Teng
dc.contributor.authorPodpod, Arnita
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorPeng, Lan
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorBex, Pieter
dc.contributor.authorDubey, Vikas
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorPodpod, Arnita
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-23T17:05:09Z
dc.date.available2021-10-23T17:05:09Z
dc.date.embargo9999-12-31
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27576
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7764694
dc.source.beginpage1
dc.source.conference6th Electronics System-Integration Technology Conference - ESTC
dc.source.conferencedate13/09/2016
dc.source.conferencelocationGrenoble France
dc.source.endpage5
dc.title

On the feasibility of die-to-wafer inorganic dielectric bonding

dc.typeProceedings paper
dspace.entity.typePublication
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