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Conference contributions
Probing complexities of 3D-stacked ICs – A test engineers' perspective
Publication:
Probing complexities of 3D-stacked ICs – A test engineers' perspective
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Date
2020
Meeting abstract
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Fodor, Ferenc
;
De Wachter, Bart
;
Podpod, Arnita
;
Stucchi, Michele
;
Marinissen, Erik Jan
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Abstract
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1905
since deposited on 2021-10-28
Acq. date: 2026-07-17
Citations
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Views
1905
since deposited on 2021-10-28
Acq. date: 2026-07-17
Citations