Study on Process Induced out-of-plane deformation for Fan-Out Wafer Level Packaging

Thumbnail
Metadata
Show full item record
Authors
Salahouelhadj, Abdellah; Gonzalez, Mario; Podpod, Arnita; Beyne, Eric
EISBN
978-1-7281-6293-5
ISSN
na
Conference
8th IEEE Electronics System-Integration Technology Conference (ESTC)
Journal
na
Title
Study on Process Induced out-of-plane deformation for Fan-Out Wafer Level Packaging
Publication type
Proceedings paper
Collections

Version history

VersionItemDateSummary
220.500.12860/38045.2*2021-12-08T10:48:32Zvalidation by library/open access desk
120.500.12860/380452021-11-02T16:03:21Z

*Selected version