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Investigating moisture diffusion in Mold Compounds (MCs) for Fan-Out-Wafer-Level-Packaging (FOWLP)

dc.contributor.authorSalahouelhadj, Abdellah
dc.contributor.authorGonzalez, Mario
dc.contributor.authorPodpod, Arnita
dc.contributor.authorBeyne, Eric
dc.date.accessioned2023-02-20T13:59:11Z
dc.date.available2022-09-17T02:52:08Z
dc.date.available2023-02-20T13:59:11Z
dc.date.issued2022
dc.identifier.issn0569-5503
dc.identifier.otherWOS:000848765300261
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40442.2
dc.sourceWOS
dc.titleInvestigating moisture diffusion in Mold Compounds (MCs) for Fan-Out-Wafer-Level-Packaging (FOWLP)
dc.typeProceedings paper
dc.contributor.imecauthorSalahouelhadj, Abdellah
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorPodpod, Arnita
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSalahouelhadj, Abdellah::0000-0002-3795-1446
dc.contributor.orcidimecGonzalez, Mario::0000-0003-4374-4854
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.identifier.doi10.1109/ECTC51906.2022.00268
dc.identifier.eisbn978-1-6654-7943-1
dc.source.numberofpages7
dc.source.peerreviewyes
dc.source.beginpage1704
dc.source.endpage1710
dc.source.conference72nd IEEE Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateMAY 31-JUN 01, 2022
dc.source.conferencelocationSan Diego
dc.source.journalna
imec.availabilityPublished - imec


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220.500.12860/40442.2*2023-02-20T13:57:29Zvalidation by library/open access desk
120.500.12860/404422022-09-17T02:52:08Z

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