Browsing Articles by imec author "4ce8f793dd2c1b308f8803368c54eae87c628fb1"
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Characterization and benchmarking of the low inter-tier thermal resistance of 3D hybrid Cu/dielectric wafer-to-wafer bonding
Oprins, Herman; Cherman, Vladimir; Webers, Tomas; Salahouelhadj, Abdellah; Kim, Soon-Wook; Peng, Lan; Van der Plas, Geert; Beyne, Eric (2017-03) -
High density interconnect substrates using multilayer thin film technology on laminate substrates (MCM-SL/D)
Beyne, Eric; Van Hoof, Rita; Webers, Tomas; Brebels, Steven; Rossi, S.; Lechleiter, F.; Di Ianni, M.; Ostmann, A. (2001)