Browsing Articles by imec author "d482195c251b3890cc7dea7084a8e609d5ca1b7f"
Now showing items 1-2 of 2
-
Formation, processing and characterization of Co-Sn intermetallic compounds for potential integration in 3D interconnects
Vakanas, George; O, Minho; Dimcic, Biljana; Vanstreels, Kris; Vandecasteele, Bjorn; De Preter, Inge; Derakhshandeh, Jaber; Rebibis, Kenneth June; Kajihara, Masanori; De Wolf, Ingrid; Beyne, Eric (2015) -
Investigation of Co thin film as buffer layer applied to Cu/Sn eutectic bonding and UBM with Sn, SnCu, and SAC solders joints
Tang, Ya-Sheng; Derakhshandeh, Jaber; Kho, Yi-Tung; Chang, Yao-Jen; Slabbekoorn, John; De Preter, Inge; Vanstreels, Kris; Rebibis, Kenneth June; Beyne, Eric; Chen, Kuan-Neng (2017)