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Studies of copper surfaces modified by thermal and plasma treatments

dc.contributor.authorBeyer, Gerald
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorConard, Thierry
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-14T16:37:23Z
dc.date.available2021-10-14T16:37:23Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5060
dc.sourceIIOimport
dc.titleStudies of copper surfaces modified by thermal and plasma treatments
dc.typeProceedings paper
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorConard, Thierry
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecConard, Thierry::0000-0002-4298-5851
dc.source.peerreviewno
dc.source.beginpageD9.17.1
dc.source.endpageD9.17.6
dc.source.conferenceMaterials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics; MRS Spring Meeting 2000 Symposium.
dc.source.conferencedate23/04/2000
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec
imec.internalnotesMaterials Research Society Symposium Proceedings; Vol. 612


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