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Assembly of advanced integrated circuits: flip chip interconnections, thin film I/O redistribution and chip sized packages

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-14T16:37:25Z
dc.date.available2021-10-14T16:37:25Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5061
dc.sourceIIOimport
dc.titleAssembly of advanced integrated circuits: flip chip interconnections, thin film I/O redistribution and chip sized packages
dc.typeOral presentation
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceElectronic Design: Trends en Ontwikkelingen in de Wereld die Kleiner Wordt; May 17, 2001; Eindhoven, The Netherlands.
dc.source.conferencelocation
imec.availabilityPublished - imec


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