| dc.contributor.author | Beyne, Eric | |
| dc.date.accessioned | 2021-10-14T16:37:27Z | |
| dc.date.available | 2021-10-14T16:37:27Z | |
| dc.date.issued | 2001 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/5062 | |
| dc.source | IIOimport | |
| dc.title | Assembly using flip chip instead of wire-bonding | |
| dc.type | Oral presentation | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.source.peerreview | no | |
| dc.source.conference | Electronic Forum, Flip-Chip & Chip Scale Europe; March 21, 2001; Böblingen, Germany. | |
| dc.source.conferencelocation | | |
| imec.availability | Published - imec | |
