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Multilayer thin film technology with integrated passive components: enabling technology for microwave "systems-in-a-package" integration

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-14T16:37:29Z
dc.date.available2021-10-14T16:37:29Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5063
dc.sourceIIOimport
dc.titleMultilayer thin film technology with integrated passive components: enabling technology for microwave "systems-in-a-package" integration
dc.typeOral presentation
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceMesago Conference, System Integration in Microelectronics; April 25, 2001; Nuremberg, Germany.
dc.source.conferencelocation
imec.availabilityPublished - imec


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