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Technologies for very high bandwidth electrical interconnects between next generation VLSI circuits

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-14T16:37:31Z
dc.date.available2021-10-14T16:37:31Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5064
dc.sourceIIOimport
dc.titleTechnologies for very high bandwidth electrical interconnects between next generation VLSI circuits
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpageS23
dc.source.endpage3
dc.source.conferenceIEDM Technical Digest; 2-5 December 2001; Washington, D.C., USA.
dc.source.conferencelocation
imec.availabilityPublished - imec


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