Show simple item record

High density interconnect substrates using multilayer thin film technology on laminate substrates (MCM-SL/D)

dc.contributor.authorBeyne, Eric
dc.contributor.authorVan Hoof, Rita
dc.contributor.authorWebers, Tomas
dc.contributor.authorBrebels, Steven
dc.contributor.authorRossi, S.
dc.contributor.authorLechleiter, F.
dc.contributor.authorDi Ianni, M.
dc.contributor.authorOstmann, A.
dc.date.accessioned2021-10-14T16:37:35Z
dc.date.available2021-10-14T16:37:35Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5066
dc.sourceIIOimport
dc.titleHigh density interconnect substrates using multilayer thin film technology on laminate substrates (MCM-SL/D)
dc.typeJournal article
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVan Hoof, Rita
dc.contributor.imecauthorWebers, Tomas
dc.contributor.imecauthorBrebels, Steven
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecBrebels, Steven::0000-0002-1568-0286
dc.source.peerreviewno
dc.source.beginpage36
dc.source.endpage42
dc.source.journalMicroelectronics International
dc.source.issue3
dc.source.volume18
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record