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Grain growth in electroplated copper

dc.contributor.authorBrongersma, Sywert
dc.contributor.authorKerr, Emma
dc.contributor.authorVervoort, Iwan
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-14T16:39:07Z
dc.date.available2021-10-14T16:39:07Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5099
dc.sourceIIOimport
dc.titleGrain growth in electroplated copper
dc.typeOral presentation
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.source.peerreviewno
dc.source.conferenceMRS Spring Meeting. Symposium L: Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics; April
dc.source.conferencelocation
imec.availabilityPublished - imec


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