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Stress and impurities in electroplated copper

dc.contributor.authorBrongersma, Sywert
dc.contributor.authorKerr, Emma
dc.contributor.authorVervoort, Iwan
dc.contributor.authorRichard, Emmanuel
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-14T16:39:13Z
dc.date.available2021-10-14T16:39:13Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5101
dc.sourceIIOimport
dc.titleStress and impurities in electroplated copper
dc.typeProceedings paper
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.source.peerreviewno
dc.source.beginpage161
dc.source.endpage165
dc.source.conferenceAdvanced Metallization Conference 2000
dc.source.conferencedate3/10/2000
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - imec
imec.internalnotesConference Proceedings ULSI XVI


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