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Characterisation of IC packages for RF applications

dc.contributor.authorChandrasekhar, Arun
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorNauwelaers, Bart
dc.date.accessioned2021-10-14T16:41:03Z
dc.date.available2021-10-14T16:41:03Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5131
dc.sourceIIOimport
dc.titleCharacterisation of IC packages for RF applications
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorNauwelaers, Bart
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.source.peerreviewno
dc.source.beginpage4
dc.source.conferenceProceedings 9th URSI Forum; Cecember 2001; Louvain-la-Neuve, Belgium.
dc.source.conferencelocation
imec.availabilityPublished - imec


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