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dc.contributor.authorChandrasekhar, Arun
dc.contributor.authorPieters, Philip
dc.contributor.authorVaesen, Kristof
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorNauwelaers, Bart
dc.contributor.authorVan Puymbroeck, Jan
dc.date.accessioned2021-10-14T16:41:11Z
dc.date.available2021-10-14T16:41:11Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5133
dc.sourceIIOimport
dc.titleThe Polymer Stud Grid Array (PSGA) package: test and electrical characterization for RF applications
dc.typeProceedings paper
dc.contributor.imecauthorPieters, Philip
dc.contributor.imecauthorVaesen, Kristof
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorNauwelaers, Bart
dc.contributor.imecauthorVan Puymbroeck, Jan
dc.contributor.orcidimecVaesen, Kristof::0000-0001-9971-3593
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.source.peerreviewno
dc.source.beginpage496
dc.source.endpage501
dc.source.conferenceProceedings International Conference on Electronics Packaging; 18-20 April 2001; Tokyo, Japan.
dc.source.conferencelocation
imec.availabilityPublished - imec


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