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Micro-Raman spectroscopy study of the mechanical stress induced by BGA-assembly and validation by FEM

dc.contributor.authorChen, Jian
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorChan, M.
dc.date.accessioned2021-10-14T16:41:19Z
dc.date.available2021-10-14T16:41:19Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5135
dc.sourceIIOimport
dc.titleMicro-Raman spectroscopy study of the mechanical stress induced by BGA-assembly and validation by FEM
dc.typeProceedings paper
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewno
dc.source.beginpage34
dc.source.endpage38
dc.source.conferenceProceedings 13th European Microelectronics and Packaging Conference & Exhibition; 30 May - 1 June 2001; Strasbourg, France.
dc.source.conferencelocation
imec.availabilityPublished - imec


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