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Novel electroless bumping technologies for MCM-D: bumping of single chips and straight-wall bumping on cu metallisations

dc.contributor.authorDe Pauw, Herbert
dc.contributor.authorVanfleteren, Jan
dc.contributor.authorDe Baets, Johan
dc.contributor.authorVan Calster, Andre
dc.date.accessioned2021-10-14T16:46:28Z
dc.date.available2021-10-14T16:46:28Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5200
dc.sourceIIOimport
dc.titleNovel electroless bumping technologies for MCM-D: bumping of single chips and straight-wall bumping on cu metallisations
dc.typeProceedings paper
dc.contributor.imecauthorDe Pauw, Herbert
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.imecauthorDe Baets, Johan
dc.contributor.imecauthorVan Calster, Andre
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.source.peerreviewno
dc.source.beginpage302
dc.source.endpage307
dc.source.conferenceProceedings of the International Conference on High-Density Interconnect and Systems Packaging; April 2001; Santa Clara, CA, USA
dc.source.conferencelocation
imec.availabilityPublished - imec


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