Show simple item record

0-Level packaging techniques for flip-chip mounted MMICs

dc.contributor.authorDe Raedt, Walter
dc.contributor.authorBrebels, Steven
dc.contributor.authorMonfraix, P.
dc.contributor.authorCarchon, Geert
dc.contributor.authorJourdain, Anne
dc.contributor.authorTilmans, Harrie
dc.date.accessioned2021-10-14T16:46:34Z
dc.date.available2021-10-14T16:46:34Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5201
dc.sourceIIOimport
dc.title0-Level packaging techniques for flip-chip mounted MMICs
dc.typeProceedings paper
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorBrebels, Steven
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.contributor.orcidimecBrebels, Steven::0000-0002-1568-0286
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.source.peerreviewno
dc.source.beginpage239
dc.source.endpage242
dc.source.conferenceGAAS - European Gallium Arsenide and other Semiconductors Application Symposium
dc.source.conferencedate24/09/2001
dc.source.conferencelocationLondon
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record