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Simulation of solder joint reliability for CBGA packages

dc.contributor.authorDegryse, Dominiek
dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.authorChristiaens, Filip
dc.contributor.authorRoose, Erik
dc.contributor.authorCorlatan, D.
dc.date.accessioned2021-10-14T16:49:25Z
dc.date.available2021-10-14T16:49:25Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5232
dc.sourceIIOimport
dc.titleSimulation of solder joint reliability for CBGA packages
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage360
dc.source.endpage364
dc.source.conferenceProceedings 13th European Microelectronics and Packaging Conference & Exhibition; 30 May - 1 June 2001; Strasbourg, France.
dc.source.conferencelocation
imec.availabilityPublished - imec


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