Show simple item record

dc.contributor.authorDonaton, R. A.
dc.contributor.authorCoenegrachts, Bart
dc.contributor.authorMaenhoudt, Mireille
dc.contributor.authorPollentier, Ivan
dc.contributor.authorStruyf, Herbert
dc.contributor.authorVanhaelemeersch, Serge
dc.contributor.authorVos, I.
dc.contributor.authorMeuris, Marc
dc.contributor.authorFyen, Wim
dc.contributor.authorBeyer, Gerald
dc.contributor.authorTokei, Zsolt
dc.contributor.authorStucchi, Michele
dc.contributor.authorVervoort, Iwan
dc.contributor.authorDe Roest, David
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-14T16:52:23Z
dc.date.available2021-10-14T16:52:23Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5261
dc.sourceIIOimport
dc.titleIntegration of Cu and low-K dielectrics: effect of hard mask and dry etch on electrical performance of damascene structures
dc.typeJournal article
dc.contributor.imecauthorCoenegrachts, Bart
dc.contributor.imecauthorPollentier, Ivan
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.imecauthorMeuris, Marc
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorDe Roest, David
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecPollentier, Ivan::0000-0002-4266-6500
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.contributor.orcidimecMeuris, Marc::0000-0002-9580-6810
dc.source.peerreviewno
dc.source.beginpage277
dc.source.endpage283
dc.source.journalMicroelectronic Engineering
dc.source.issue1_4
dc.source.volume55
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record