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The PSGA, a lead-free CSP for high performance & high reliable packaging

dc.contributor.authorDriessens, Evelien
dc.contributor.authorVandevelde, Bart
dc.contributor.authorChandrasekhar, Arun
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-14T16:53:37Z
dc.date.available2021-10-14T16:53:37Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5272
dc.sourceIIOimport
dc.titleThe PSGA, a lead-free CSP for high performance & high reliable packaging
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage435
dc.source.endpage440
dc.source.conferenceConference Proceedings of the 13th European Microelectronics and Packaging Conference & Exhibition
dc.source.conferencedate30/05/2001
dc.source.conferencelocation
imec.availabilityPublished - imec


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