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Pattern dependent corrosion effects in HF based post-Cu CMP cleanings

dc.contributor.authorFyen, Wim
dc.contributor.authorTeerlinck, Ivo
dc.contributor.authorLagrange, Sébastien
dc.contributor.authorBrongersma, Sywert
dc.contributor.authorSteegen, An
dc.contributor.authorMertens, Paul
dc.contributor.authorHeyns, Marc
dc.date.accessioned2021-10-14T16:57:22Z
dc.date.available2021-10-14T16:57:22Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5305
dc.sourceIIOimport
dc.titlePattern dependent corrosion effects in HF based post-Cu CMP cleanings
dc.typeProceedings paper
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorMertens, Paul
dc.contributor.imecauthorHeyns, Marc
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage275
dc.source.endpage278
dc.source.conferenceUltra Clean Processing of Silicon Surfaces 2000: Proceedings of the 5th International Conference - UCPSS
dc.source.conferencedate18/09/2000
dc.source.conferencelocationOostende Belgium
imec.availabilityPublished - open access
imec.internalnotesSolid State Phenomena. Part B; Vol. 76-77


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