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Standard SMT process for flip-chip assembly on FR4 substrate

dc.contributor.authorHarris, S.
dc.contributor.authorPatra, G.
dc.contributor.authorMainwaring, S.
dc.contributor.authorSchols, G.
dc.contributor.authorMathelin, D.
dc.contributor.authorCorlatan, D.
dc.contributor.authorRaedschelders, E.
dc.contributor.authorDe Langhe, Pascal
dc.contributor.authorDe Baets, Johan
dc.contributor.authorVereeken, Maria
dc.contributor.authorVan Calster, Andre
dc.contributor.authorMorrell, M
dc.contributor.authorHaley, C.
dc.contributor.authorOstman, A.
dc.date.accessioned2021-10-14T17:01:00Z
dc.date.available2021-10-14T17:01:00Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5335
dc.sourceIIOimport
dc.titleStandard SMT process for flip-chip assembly on FR4 substrate
dc.typeProceedings paper
dc.contributor.imecauthorDe Baets, Johan
dc.contributor.imecauthorVan Calster, Andre
dc.source.peerreviewno
dc.source.beginpage1
dc.source.endpage13
dc.source.conferenceProceedings of the Electronics Assembly Process Exhibition Conference - APEX; January 2001; San Diego, USA.
dc.source.conferencelocation
imec.availabilityPublished - imec


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