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Modelling complex via hole structures

dc.contributor.authorLaermans, Eric
dc.contributor.authorDe Geest, Jan
dc.contributor.authorDe Zutter, Daniel
dc.contributor.authorOlyslager, Frank
dc.contributor.authorSercu, Jeannick
dc.contributor.authorMorlion, D.
dc.date.accessioned2021-10-14T17:11:34Z
dc.date.available2021-10-14T17:11:34Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5415
dc.sourceIIOimport
dc.titleModelling complex via hole structures
dc.typeProceedings paper
dc.contributor.imecauthorLaermans, Eric
dc.contributor.imecauthorDe Zutter, Daniel
dc.contributor.orcidimecLaermans, Eric::0000-0002-1811-9419
dc.source.peerreviewno
dc.source.beginpage149
dc.source.endpage152
dc.source.conferenceProceedings of the IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging - EPEP
dc.source.conferencedate29/10/2001
dc.source.conferencelocationCambridge, MA USA
imec.availabilityPublished - imec


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