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Adhesion study between materials for integration of copper and inorganic low-k dielectrics

dc.contributor.authorLanckmans, Filip
dc.contributor.authorBrongersma, Sywert
dc.contributor.authorPoortmans, Jef
dc.contributor.authorConard, Thierry
dc.contributor.authorBender, Hugo
dc.contributor.authorBeyne, Eric
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-14T17:13:09Z
dc.date.available2021-10-14T17:13:09Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5427
dc.sourceIIOimport
dc.titleAdhesion study between materials for integration of copper and inorganic low-k dielectrics
dc.typeOral presentation
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorPoortmans, Jef
dc.contributor.imecauthorConard, Thierry
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.contributor.orcidimecPoortmans, Jef::0000-0003-2077-2545
dc.contributor.orcidimecConard, Thierry::0000-0002-4298-5851
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceMRS Spring Meeting. Symposium L: Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics; April
dc.source.conferencelocation
imec.availabilityPublished - open access


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