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Optimized thermal processing for Ti-Capped CoSi2 for 0.13 μm technology

dc.contributor.authorLindsay, Richard
dc.contributor.authorLauwers, A.
dc.contributor.authorde Potter de ten Broeck, Muriel
dc.contributor.authorRoelandts, Nico
dc.contributor.authorVrancken, Christa
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-14T17:16:03Z
dc.date.available2021-10-14T17:16:03Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5447
dc.sourceIIOimport
dc.titleOptimized thermal processing for Ti-Capped CoSi2 for 0.13 μm technology
dc.typeJournal article
dc.contributor.imecauthorde Potter de ten Broeck, Muriel
dc.contributor.imecauthorVrancken, Christa
dc.contributor.imecauthorMaex, Karen
dc.source.peerreviewno
dc.source.beginpage157
dc.source.endpage162
dc.source.journalMicroelectronic Engineering
dc.source.issue1_4
dc.source.volume55
imec.availabilityPublished - imec


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