dc.contributor.author | Lindsay, Richard | |
dc.contributor.author | Lauwers, A. | |
dc.contributor.author | de Potter de ten Broeck, Muriel | |
dc.contributor.author | Roelandts, Nico | |
dc.contributor.author | Vrancken, Christa | |
dc.contributor.author | Maex, Karen | |
dc.date.accessioned | 2021-10-14T17:16:03Z | |
dc.date.available | 2021-10-14T17:16:03Z | |
dc.date.issued | 2001 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/5447 | |
dc.source | IIOimport | |
dc.title | Optimized thermal processing for Ti-Capped CoSi2 for 0.13 μm technology | |
dc.type | Journal article | |
dc.contributor.imecauthor | de Potter de ten Broeck, Muriel | |
dc.contributor.imecauthor | Vrancken, Christa | |
dc.contributor.imecauthor | Maex, Karen | |
dc.source.peerreview | no | |
dc.source.beginpage | 157 | |
dc.source.endpage | 162 | |
dc.source.journal | Microelectronic Engineering | |
dc.source.issue | 1_4 | |
dc.source.volume | 55 | |
imec.availability | Published - imec | |