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Flat package inductance extraction with ground plane current precalculation

dc.contributor.authorLippens, Gunther
dc.contributor.authorDe Zutter, Daniel
dc.date.accessioned2021-10-14T17:16:20Z
dc.date.available2021-10-14T17:16:20Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5449
dc.sourceIIOimport
dc.titleFlat package inductance extraction with ground plane current precalculation
dc.typeProceedings paper
dc.contributor.imecauthorDe Zutter, Daniel
dc.source.peerreviewno
dc.source.beginpage221
dc.source.endpage224
dc.source.conferenceProceedings of the IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging - EPEP
dc.source.conferencedate29/10/2001
dc.source.conferencelocationCambridge, MA USA
imec.availabilityPublished - imec


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