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193-nm contact photoresist reflow feasibility study

dc.contributor.authorLucas, Kevin
dc.contributor.authorSlezak, Mark
dc.contributor.authorErcken, Monique
dc.contributor.authorVan Roey, Frieda
dc.date.accessioned2021-10-14T17:17:31Z
dc.date.available2021-10-14T17:17:31Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5457
dc.sourceIIOimport
dc.title193-nm contact photoresist reflow feasibility study
dc.typeProceedings paper
dc.contributor.imecauthorErcken, Monique
dc.contributor.imecauthorVan Roey, Frieda
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage725
dc.source.endpage737
dc.source.conferenceAdvances in Resist Technology and Processing XVIII
dc.source.conferencedate26/02/2001
dc.source.conferencelocationSanta Clara, CA USA
imec.availabilityPublished - open access
imec.internalnotesProceedings of SPIE; Vol. 4345


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