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Force constants for liquid solder bumps with unequal pad sizes

dc.contributor.authorVan Veen, C.
dc.contributor.authorVandevelde, Bart
dc.date.accessioned2021-10-14T18:08:50Z
dc.date.available2021-10-14T18:08:50Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5759
dc.sourceIIOimport
dc.titleForce constants for liquid solder bumps with unequal pad sizes
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.source.peerreviewno
dc.source.beginpage249
dc.source.endpage254
dc.source.conferenceProceedings of the 2nd Eurosime Conference; 9-11 April 2001; Paris, France.
dc.source.conferencelocation
imec.availabilityPublished - imec


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