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Solder parameter sensitivity for CSP life-time prediction using simulation-based optimization method

dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.authorZhang, K. G. Q.
dc.contributor.authorCaers, J.
dc.date.accessioned2021-10-14T18:13:55Z
dc.date.available2021-10-14T18:13:55Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5786
dc.sourceIIOimport
dc.titleSolder parameter sensitivity for CSP life-time prediction using simulation-based optimization method
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage281
dc.source.endpage287
dc.source.conferenceProceedings 51st Electronic Components and Technology Conference
dc.source.conferencedate29/05/2001
dc.source.conferencelocationOrlando, FL USA
imec.availabilityPublished - imec


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