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Low temperature flip-chip assembly for biomedical applications

dc.contributor.authorVanfleteren, Jan
dc.contributor.authorVandecasteele, Bjorn
dc.contributor.authorPodprockŭ, T.
dc.contributor.authorJacobs, Philippe
dc.date.accessioned2021-10-14T18:14:42Z
dc.date.available2021-10-14T18:14:42Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5790
dc.sourceIIOimport
dc.titleLow temperature flip-chip assembly for biomedical applications
dc.typeProceedings paper
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.imecauthorVandecasteele, Bjorn
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.source.peerreviewno
dc.source.beginpage213
dc.source.endpage216
dc.source.conferenceProceedings of 13th European Microelectronics and Packaging Conference and Exhibition; May 2001; Strassbourg, France.
dc.source.conferencelocation
imec.availabilityPublished - imec


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