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Copper CMP using a Lam teres linear planarization technology

dc.contributor.authorVos, I.
dc.contributor.authorMeuris, Marc
dc.contributor.authorSijmus, Bram
dc.contributor.authorStella, Mario
dc.contributor.authorDelaney, N.
dc.contributor.authorGobbin, Korneel
dc.date.accessioned2021-10-14T18:20:46Z
dc.date.available2021-10-14T18:20:46Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5820
dc.sourceIIOimport
dc.titleCopper CMP using a Lam teres linear planarization technology
dc.typeOral presentation
dc.contributor.imecauthorMeuris, Marc
dc.contributor.orcidimecMeuris, Marc::0000-0002-9580-6810
dc.source.peerreviewno
dc.source.conference6th International Chemical-Mechanical Polish (C.M.P.) Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC) and
dc.source.conferencelocation
imec.availabilityPublished - imec


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