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Mechanical analysis of a SiLK/Cu dual damascene interconnect system
Publication:
Mechanical analysis of a SiLK/Cu dual damascene interconnect system
Date
2001
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Waeterloos, Joost
;
Shaffer, E.
;
Stokich, T.
;
Alves Donaton, Ricardo
;
Maex, Karen
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Abstract
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1891
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations
Metrics
Views
1891
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations