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dc.contributor.authorWaeterloos, Joost
dc.contributor.authorShaffer, E. O.
dc.contributor.authorStokich, T.
dc.contributor.authorHetzner, J.
dc.contributor.authorPrice, D.
dc.contributor.authorBooms, L.
dc.contributor.authorDonaton, R. A.
dc.contributor.authorBeyer, Gerald
dc.contributor.authorCoenegrachts, Bart
dc.contributor.authorCaluwaerts, Rudy
dc.contributor.authorStruyf, Herbert
dc.contributor.authorTokei, Zsolt
dc.contributor.authorVervoort, Iwan
dc.contributor.authorSjjmus, B.
dc.contributor.authorVos, I.
dc.contributor.authorMaex, Karen
dc.contributor.authorKomiya, Takayuki
dc.contributor.authorIwashita, J. M.
dc.date.accessioned2021-10-14T18:22:11Z
dc.date.available2021-10-14T18:22:11Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5826
dc.sourceIIOimport
dc.titleIntegration of a low permittivity spin-on embedded hardmask for Cu/SiLK resin dual damascene
dc.typeProceedings paper
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorCoenegrachts, Bart
dc.contributor.imecauthorCaluwaerts, Rudy
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorMaex, Karen
dc.source.peerreviewno
dc.source.beginpage60
dc.source.endpage62
dc.source.conferenceProceedings of the IEEE 2001 International Interconnect Technology Conference
dc.source.conferencedate1/06/2001
dc.source.conferencelocationBurlingame, CA USA
imec.availabilityPublished - imec


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