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Studies on size effect of copper interconnect lines

dc.contributor.authorWu, Wen
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-14T18:26:30Z
dc.date.available2021-10-14T18:26:30Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5847
dc.sourceIIOimport
dc.titleStudies on size effect of copper interconnect lines
dc.typeProceedings paper
dc.contributor.imecauthorMaex, Karen
dc.source.peerreviewno
dc.source.beginpage416
dc.source.endpage418
dc.source.conferenceICSICT - 6th International Conference on Solid-State Integrated Circuit Technology. Proceedings
dc.source.conferencedate22/10/2001
dc.source.conferencelocationShanghai China
imec.availabilityPublished - imec


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