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Direct Au and Cu wire bonding on Cu/Low-k BEOL

dc.contributor.authorBanda, Pedro
dc.contributor.authorHo, Meng
dc.contributor.authorWhelan, Caroline
dc.contributor.authorLam, Kan Wai
dc.contributor.authorVath, C.J.
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-14T21:08:01Z
dc.date.available2021-10-14T21:08:01Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5989
dc.sourceIIOimport
dc.titleDirect Au and Cu wire bonding on Cu/Low-k BEOL
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage344
dc.source.endpage349
dc.source.conferenceProceedings 4th Electronics Packaging Technology Conference
dc.source.conferencedate10/12/2002
dc.source.conferencelocationSingapore
imec.availabilityPublished - imec


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