Browsing Presentations by imec author "7813dc6305c66871af37da599e312fe3c5d82b18"
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A unique temporary bond solution based on a thermoplastic material tacky at room temperature and highly thermally resistant application extension from 3D-SIC to FO-WLP
Phommahaxay, Alain; Nakamura, Atsushi; Potoms, Goedele; Bertheau, Julien; Bex, Pieter; Duval, Fabrice; Podpod, Arnita; Verbinnen, Greet; Kamochi, Yoshitaka; Sawano, Mitsuru; Beyer, Gerald; Sleeckx, Erik; Beyne, Eric (2017) -
Edge shape control for bonded wafer
Inoue, Fumihiro; Jourdain, Anne; Peng, Lan; Phommahaxay, Alain; De Wolf, Ingrid; Rebibis, Kenneth June; Miller, Andy; Sleeckx, Erik; Beyne, Eric (2017)