Browsing Presentations by imec author "effb224813386ea726c56f36e795aa9cb0bbb27e"
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Edge shape control for bonded wafer
Inoue, Fumihiro; Jourdain, Anne; Peng, Lan; Phommahaxay, Alain; De Wolf, Ingrid; Rebibis, Kenneth June; Miller, Andy; Sleeckx, Erik; Beyne, Eric (2017) -
MEMS packaging using 3D-Si integration approaches
Beyne, Eric; Jourdain, Anne (2008) -
The Minipackage: a flexible wafer-level packaging solution for MEMS
De Moor, Piet; Baert, Kris; Bogaerts, Lieve; Du Bois, Bert; Jamieson, Geraldine; Jourdain, Anne; Van Hoof, Chris (2004) -
Wafer bonding challenges for 3-D integration
Jourdain, Anne; Miller, Andy; Swinnen, Bart (2010)