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dc.contributor.authorBesling, Wim
dc.contributor.authorSatta, Alessandra
dc.contributor.authorSchuhmacher, Jörg
dc.contributor.authorAbell, Thomas
dc.contributor.authorSutcliffe, Victor
dc.contributor.authorMartin Hoyas, Ana
dc.contributor.authorBeyer, Gerald
dc.contributor.authorGravesteijn, Dirk
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-14T21:08:41Z
dc.date.available2021-10-14T21:08:41Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6007
dc.sourceIIOimport
dc.titleAtomic layer deposition of barriers for interconnect
dc.typeProceedings paper
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorMaex, Karen
dc.source.peerreviewno
dc.source.beginpage288
dc.source.endpage291
dc.source.conferenceProceedings of the IEEE International Interconnect Technology Conference
dc.source.conferencedate3/06/2002
dc.source.conferencelocationBurlingame, CA USA
imec.availabilityPublished - imec


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