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Systems in a package (SIPs), building blocks for a smart environment

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-14T21:08:59Z
dc.date.available2021-10-14T21:08:59Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6014
dc.sourceIIOimport
dc.titleSystems in a package (SIPs), building blocks for a smart environment
dc.typeOral presentation
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conference1st EPIC Conference: Packaging andInterconnect for Electronics, Photonics and Sensors
dc.source.conferencedate2/07/2002
dc.source.conferencelocationEdinburgh Scotland
imec.availabilityPublished - imec


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