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Grain structure evolution during annealing of electroplated copper
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Authors
Brongersma, Sywert
;
Kerr, Emma
;
Vervoort, Iwan
;
Maex, Karen
Conference
Stress-Induced Phenomena in Metallization: 6th International Workshop
Title
Grain structure evolution during annealing of electroplated copper
Publication type
Proceedings paper
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