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Foundations for successful RF chip-package co-design: a packaging perspective
Publication:
Foundations for successful RF chip-package co-design: a packaging perspective
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Date
2002
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Chandrasekhar, Arun
;
Beyne, Eric
;
De Raedt, Walter
;
Nauwelaers, Bart
Journal
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1999
since deposited on 2021-10-14
Acq. date: 2025-12-10
Citations
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Views
1999
since deposited on 2021-10-14
Acq. date: 2025-12-10
Citations